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ISL83070E, ISL83071E, ISL83072E, ISL83073E, ISL83075E, ISL83076E, ISL83078E
Data Sheet June 1, 2005 FN6115.0
15kV ESD Protected, 3.3V, Full Fail-safe, Low Power, High Speed or Slew Rate Limited, RS-485/RS-422 Transceivers
The Intersil ISL8307XE are BiCMOS 3.3V powered, single transceivers that meet both the RS-485 and RS-422 standards for balanced communication. These devices have very low bus currents (+125A/-100A), so they present a true "1/8 unit load" to the RS-485 bus. This allows up to 256 transceivers on the network without violating the RS-485 specification's 32 unit load maximum, and without using repeaters. For example, in a remote utility meter reading system, individual meter readings are routed to a concentrator via an RS-485 network, so the high allowed node count minimizes the number of repeaters required. Receiver (Rx) inputs feature a "Full Fail-Safe" design, which ensures a logic high Rx output if Rx inputs are floating, shorted, or terminated but undriven. Hot Plug circuitry ensures that the Tx and Rx outputs remain in a high impedance state while the power supply stabilizes. The ISL83070E through ISL83075E utilize slew rate limited drivers which reduce EMI, and minimize reflections from improperly terminated transmission lines, or unterminated stubs in multidrop and multipoint applications. Slew rate limited versions also include receiver input filtering to enhance noise immunity in the presence of slow input signals. The ISL83070E, ISL83071E, ISL83073E, ISL83076E are configured for full duplex (separate Rx input and Tx output pins) applications. The half duplex versions multiplex the Rx inputs and Tx outputs to allow transceivers with output disable functions in 8 lead packages.
Features
* Pb-Free Plus Anneal (RoHS Compliant) * RS-485 I/O Pin ESD Protection . . . . . . . . . . 15kV HBM - Class 3 ESD Level on all Other Pins . . . . . . >7kV HBM * Full Fail-safe (Open, Short, Terminated/Floating) Receivers * Hot Plug - Tx and Rx Outputs Remain Three-state During Power-up * True 1/8 Unit Load Allows up to 256 Devices on the Bus * Single 3.3V Supply * High Data Rates . . . . . . . . . . . . . . . . . . . . . up to 20Mbps * Low Quiescent Supply Current . . . . . . . . . . 800A (Max) - Ultra Low Shutdown Supply Current . . . . . . . . . . 10nA * -7V to +12V Common Mode Input/Output Voltage Range * Half and Full Duplex Pinouts * Three State Rx and Tx Outputs Available * Current Limiting and Thermal Shutdown for driver Overload Protection * Tiny MSOP package offering saves 50% board space
Applications
* Automated Utility Meter Reading Systems * High Node Count Systems * Field Bus Networks * Security Camera Networks * Building Environmental Control/ Lighting Systems * Industrial/Process Control Networks
TABLE 1. SUMMARY OF FEATURES PART NUMBER ISL83070E ISL83071E ISL83072E ISL83073E ISL83075E ISL83076E ISL83078E HALF/FULL DATA RATE DUPLEX (Mbps) FULL FULL HALF FULL HALF FULL HALF 0.25 0.25 0.25 0.5 0.5 20 20 SLEW-RATE # DEVICES RECEIVER/ DRIVER LIMITED? ON BUS ENABLE? YES YES YES YES YES NO NO 256 256 256 256 256 256 256 YES NO YES YES YES YES YES QUIESCENT ICC (A) 510 510 510 510 510 510 510 LOW POWER SHUTDOWN? YES NO YES YES YES YES YES PIN COUNT 14 8 8 14 8 14 8
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2005. All Rights Reserved All other trademarks mentioned are the property of their respective owners.
Pinouts
ISL83072E, ISL83075E, ISL83078E (MSOP, SOIC) TOP VIEW
RO 1 RE 2 DE 3 DI 4 D 8 7 6 5 VCC B/Z A/Y GND VCC 1 RO 2 DI 3 GND 4 D
ISL83071E (SOIC) TOP VIEW
8 7 6 5 A B Z Y
ISL83070E, ISL83073E, ISL83076E (SOIC) TOP VIEW
NC 1 RO 2 RE 3 DE 4 DI 5 GND 6 GND 7 D R 14 VCC 13 NC 12 A 11 B 10 Z 9Y 8 NC
R
R
Ordering Information (Notes 1, 2) PART NO. (BRAND) ISL83070EIBZA (83070EIBZ) ISL83071EIBZA (83071EIBZ) ISL83072EIBZA (83072EIBZ) ISL83072EIUZA (3072Z) ISL83073EIBZA (83073EIBZ) ISL83075EIBZA (83075EIBZ) ISL83075EIUZA (3075Z) ISL83076EIBZA (83076EIBZ) ISL83078EIBZA (83078EIBZ) ISL83078EIUZA (3078Z) NOTES: 1. Units also available in Tape and Reel; Add "-T" to suffix. 2. Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. TEMP. RANGE (C) -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 PACKAGE 14 Ld SOIC (Pb-Free) 8 Ld SOIC (Pb-Free) 8 Ld SOIC (Pb-Free) 8 Ld MSOP (Pb-Free) 14 Ld SOIC (Pb-Free) 8 Ld SOIC (Pb-Free) 8 Ld MSOP (Pb-Free) 14 Ld SOIC (Pb-Free) 8 Ld SOIC (Pb-Free) 8 Ld MSOP (Pb-Free) PKG. DWG. # M14.15 M8.15 M8.15 M8.118 M14.15 M8.15
Truth Tables
TRANSMITTING INPUTS RE X X 0 1 DE 1 1 0 0 DI 1 0 X X Z 0 1 High-Z High-Z * OUTPUTS Y 1 0 High-Z High-Z *
NOTE: *Shutdown Mode (See Note 9), except for ISL83071E
RECEIVING M8.118 M14.15 M8.15 M8.118 RE 0 0 0 1 1 INPUTS DE DE Half Duplex Full Duplex 0 0 0 0 1 X X X 0 1 A-B -0.05V -0.2V Inputs Open/Shorted X X OUTPUT RO 1 0 1 High-Z * High-Z
NOTE: *Shutdown Mode (See Note 9), except for ISL83071E
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Pin Descriptions
PIN RO RE DE DI GND A/Y B/Z A B Y Z VCC NC FUNCTION Receiver output: If A-B -50mV, RO is high; If A-B -200mV, RO is low; RO = High if A and B are unconnected (floating) or shorted. Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high. Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high, and are high impedance when DE is low. Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low. Ground connection. 15kV HBM ESD Protected RS-485/422 level, noninverting receiver input and noninverting driver output. Pin is an input if DE = 0; pin is an output if DE = 1. 15kV HBM ESD Protected RS-485/422 level, Inverting receiver input and inverting driver output. Pin is an input if DE = 0; pin is an output if DE = 1. 15kV HBM ESD Protected RS-485/422 level, noninverting receiver input. 15kV HBM ESD Protected RS-485/422 level, inverting receiver input. 15kV HBM ESD Protected RS-485/422 level, noninverting driver output. 15kV HBM ESD Protected RS-485/422 level, inverting driver output. System power supply input (3.0V to 3.6V). No Connection.
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Typical Operating Circuits
ISL83072E, ISL83075E, ISL83078E
+3.3v + 8 VCC 1 RO 2 RE 3 DE 4 DI R B/Z 7 A/Y 6 RT RT 7 B/Z 6 A/Y 0.1F 0.1F + 8 VCC D DI 4 DE 3 RE 2 R GND 5 GND 5 RO 1 +3.3v
D
ISL83071E
+3.3v + 1 VCC 2 RO A8 R B7 RT RT 5 6 Y Z D 0.1F 0.1F + 1 VCC DI 3 +3.3v
3 DI
Z6 D GND 4 Y5
7B 8A GND 4 R
RO 2
ISL83070E, ISL83073E, ISL83076E
+3.3v + 14 VCC 2 RO 3 RE 4 DE 5 DI Z 10 D GND 6, 7 Y9 RT 11 B 12 A GND 6, 7 R R A 12 B 11 0.1F RT 0.1F + 14 9Y 10 Z VCC D DI 5 DE 4 RE 3 RO 2 +3.3v
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FN6115.0 June 1, 2005
Absolute Maximum Ratings
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Input Voltages DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V Input / Output Voltages A, B, Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +13V RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC +0.3V) Short Circuit Duration Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Thermal Information
Thermal Resistance (Typical, Note 3)
JA (C/W)
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . 105 8 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . . . 140 14 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 128 Maximum Junction Temperature (Plastic Package) . . . . . . . 150C Maximum Storage Temperature Range . . . . . . . . . . . -65C to 150C Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300C (Lead Tips Only)
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . .-40C to 85C
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE: 3. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
Test Conditions: VCC = 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = 25C, Note 4 SYMBOL TEST CONDITIONS TEMP (C) MIN TYP MAX UNITS
PARAMETER DC CHARACTERISTICS Driver Differential VOUT
VOD
RL = 100 (RS-422) (Figure 1A, Note 15) RL = 54 (RS-485) (Figure 1A) No Load RL = 60, -7V VCM 12V (Figure 1B)
Full Full
2 1.5 -
2.3 2 2.2 0.01
VCC VCC 0.2
V V
Full Full
1.5 -
V V
Change in Magnitude of Driver Differential VOUT for Complementary Output States Driver Common-Mode VOUT Change in Magnitude of Driver Common-Mode VOUT for Complementary Output States Logic Input High Voltage Logic Input Low Voltage Logic Input Hysteresis Logic Input Current Input Current (A, B, A/Y, B/Z)
VOD
RL = 54 or 100 (Figure 1A)
VOC VOC
RL = 54 or 100 (Figure 1A) RL = 54 or 100 (Figure 1A)
Full Full
-
2 0.01
3 0.2
V V
VIH VIL VHYS IIN1 IIN2 IIN3 IIN4 IOSD1 VTH VTH VOH VOL
DI, DE, RE DI, DE, RE DE, RE, (Note 14) DI = DE = RE = 0V or VCC DE = 0V, VCC = 0V or 3.6V RE = 0V, DE = 0V, VCC = 0V or 3.6V RE = VCC, DE = 0V, VCC = 0V or 3.6V VIN = 12V VIN = -7V VIN = 12V VIN = -7V VIN = 12V VIN = -7V
Full Full 25 Full Full Full Full Full Full Full Full Full 25 Full Full
2 -2 -100 -40 -40 -200 VCC - 0.6 -
100 80 -50 10 -10 10 -10 -125 15 0.17
0.8 2 125 40 40 250 -50 0.4
V V mV A A A A A A A mA mV mV V V
Output Leakage Current (Y, Z) (Full Duplex Versions Only) Output Leakage Current (Y, Z) in Shutdown Mode (Full Duplex) Driver Short-Circuit Current, VO = High or Low Receiver Differential Threshold Voltage Receiver Input Hysteresis Receiver Output High Voltage Receiver Output Low Voltage
DE = VCC, -7V VY or VZ 12V (Note 6) -7V VCM 12V VCM = 0V IO = -4mA, VID = -50mV IO = -4mA, VID = -200mV
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FN6115.0 June 1, 2005
Electrical Specifications
Test Conditions: VCC = 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = 25C, Note 4 (Continued) SYMBOL IOZR RIN IOSR TSD ICC DI = 0V or VCC DE = VCC, RE = 0V or VCC DE = 0V, RE = 0V TEST CONDITIONS 0.4V VO 2.4V -7V VCM 12V 0V VO VCC TEMP (C) Full Full Full Full MIN -1 96 7 TYP 0.015 150 30 150 MAX 1 60 UNITS A k mA C
PARAMETER Three-State (high impedance) Receiver Output Current Receiver Input Resistance Receiver Short-Circuit Current Thermal Shutdown Threshold SUPPLY CURRENT No-Load Supply Current (Note 5)
Full Full Full
-
510 480 0.01
800 700 1
A A A
Shutdown Supply Current (Note 12) ESD PERFORMANCE RS-485 Pins (A, Y, B, Z) All Other Pins
ISHDN
DE = 0V, RE = VCC, DI = 0V or VCC
Human Body Model (HBM), Pin to GND HBM, per MIL-STD-883 Method 3015
25 25
-
15 >7
-
kV kV
DRIVER SWITCHING CHARACTERISTICS (ISL83070E, ISL83071E, ISL83072E, 250kbps) Maximum Data Rate Driver Differential Output Delay Driver Differential Output Skew Driver Differential Rise or Fall Time Driver Enable to Output High Driver Enable to Output Low Driver Disable from Output High Driver Disable from Output Low Time to Shutdown Driver Enable from Shutdown to Output High Driver Enable from Shutdown to Output Low fMAX tDD tSKEW tR, tF tZH tZL tHZ tLZ tSHDN VOD = 1.5V, CD = 820pF (Figure 4, Note 16) RDIFF = 54, CD = 50pF (Figure 2) RDIFF = 54, CD = 50pF (Figure 2) RDIFF = 54, CD = 50pF (Figure 2) RL = 500, CL = 50pF, SW = GND (Figure 3), (Notes 7, 12) RL = 500, CL = 50pF, SW = VCC (Figure 3), (Notes 7, 12) RL = 500, CL = 50pF, SW = GND (Figure 3), (Note 12) RL = 500, CL = 50pF, SW = VCC (Figure 3), (Note 12) (Notes 9, 12) Full Full Full Full Full Full Full Full Full Full Full 250 250 350 50 800 1100 6 960 26 200 28 30 200 180 100 1500 100 1600 600 600 55 55 600 700 700 kbps ns ns ns ns ns ns ns ns ns ns
tZH(SHDN) RL = 500, CL = 50pF, SW = GND (Figure 3), (Notes 9, 10, 12) tZL(SHDN) RL = 500, CL = 50pF, SW = VCC (Figure 3), (Notes 9, 10, 12)
DRIVER SWITCHING CHARACTERISTICS (ISL83073E, ISL83075E, 500kbps) Maximum Data Rate Driver Differential Output Delay Driver Differential Output Skew Driver Differential Rise or Fall Time Driver Enable to Output High Driver Enable to Output Low Driver Disable from Output High Driver Disable from Output Low Time to Shutdown fMAX tDD tSKEW tR, tF tZH tZL tHZ tLZ tSHDN VOD = 1.5V, CD = 820pF (Figure 4, Note 16) RDIFF = 54, CD = 50pF (Figure 2) RDIFF = 54, CD = 50pF (Figure 2) RDIFF = 54, CD = 50pF (Figure 2) RL = 500, CL = 50pF, SW = GND (Figure 3), (Notes 7, 12) RL = 500, CL = 50pF, SW = VCC (Figure 3), (Notes 7, 12) RL = 500, CL = 50pF, SW = GND (Figure 3), (Note 12) RL = 500, CL = 50pF, SW = VCC (Figure 3), (Note 12) (Notes 9, 12) Full Full Full Full Full Full Full Full Full 500 180 200 50 1600 350 1 380 26 100 28 30 200 800 30 800 350 350 55 55 600 kbps ns ns ns ns ns ns ns ns
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FN6115.0 June 1, 2005
Electrical Specifications
Test Conditions: VCC = 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = 25C, Note 4 (Continued) SYMBOL TEST CONDITIONS TEMP (C) Full Full MIN TYP 180 100 MAX 700 700 UNITS ns ns
PARAMETER Driver Enable from Shutdown to Output High Driver Enable from Shutdown to Output Low
tZH(SHDN) RL = 500, CL = 50pF, SW = GND (Figure 3), (Notes 9, 10, 12) tZL(SHDN) RL = 500, CL = 50pF, SW = VCC (Figure 3), (Notes 9, 10, 12)
DRIVER SWITCHING CHARACTERISTICS (ISL83076E, ISL83078E, 20Mbps) Maximum Data Rate Driver Differential Output Delay Driver Differential Output Skew Driver Output Skew, Part-to-Part Driver Differential Rise or Fall Time Driver Enable to Output High Driver Enable to Output Low Driver Disable from Output High Driver Disable from Output Low Time to Shutdown Driver Enable from Shutdown to Output High Driver Enable from Shutdown to Output Low fMAX tDD tSKEW tDSKEW tR, tF tZH tZL tHZ tLZ tSHDN VOD = 1.5V, CD = 350pF (Figure 4, Note 16) RDIFF = 54, CD = 50pF (Figure 2) RDIFF = 54, CD = 50pF (Figure 2) RDIFF = 54, CD = 50pF (Figure 2, Note 13) RDIFF = 54, CD = 50pF (Figure 2) RL = 500, CL = 50pF, SW = GND (Figure 3), (Notes 7, 12) RL = 500, CL = 50pF, SW = VCC (Figure 3), (Notes 7, 12) RL = 500, CL = 50pF, SW = GND (Figure 3), (Note 12) RL = 500, CL = 50pF, SW = VCC (Figure 3), (Note 12) (Notes 9, 12) Full Full Full Full Full Full Full Full Full Full Full Full 20 50 28 27 1 9 17 16 25 28 200 180 90 40 3 11 15 50 40 40 50 600 700 700 Mbps ns ns ns ns ns ns ns ns ns ns ns
tZH(SHDN) RL = 500, CL = 50pF, SW = GND (Figure 3), (Notes 9, 10, 12) tZL(SHDN) RL = 500, CL = 50pF, SW = VCC (Figure 3), (Notes 9, 10, 12)
RECEIVER SWITCHING CHARACTERISTICS (All Versions) Maximum Data Rate fMAX VID = 1.5V (Note 16) ISL83070E-75E ISL83076E-78E Receiver Input to Output Delay tPLH, tPHL (Figure 5) tSKD tRSKEW tZH (Figure 5) (Figure 5, Note 13) RL = 1k, CL = 15pF, SW = GND (Figure 6), (Notes 8, 12) RL = 1k, CL = 15pF, SW = VCC (Figure 6), (Notes 8, 12) RL = 1k, CL = 15pF, SW = GND (Figure 6), (Note 12) RL = 1k, CL = 15pF, SW = VCC (Figure 6), (Note 12) (Notes 9, 12) ISL83070E-75E ISL83076E-78E ISL83070E-75E ISL83076E-78E ISL83070E-75E ISL83076E-78E ISL83070E-75E ISL83076E-78E ISL83070E-75E ISL83076E-78E Receiver Skew | tPLH - tPHL | Receiver Skew, Part-to-Part Receiver Enable to Output High Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full 12 20 25 25 5 5 5 5 5 4 5 4 50 20 35 70 33 1.5 15 11 15 11 12 7 13 7 180 240 240 120 60 4 15 20 17 20 17 20 15 20 15 600 500 500 Mbps Mbps ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
Receiver Enable to Output Low
tZL
Receiver Disable from Output High
tHZ
Receiver Disable from Output Low
tLZ
Time to Shutdown Receiver Enable from Shutdown to Output High Receiver Enable from Shutdown to Output Low
tSHDN
tZH(SHDN) RL = 1k, CL = 15pF, SW = GND (Figure 6), (Notes 9, 11, 12) tZL(SHDN) RL = 1k, CL = 15pF, SW = VCC (Figure 6), (Notes 9, 11, 12)
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FN6115.0 June 1, 2005
Electrical Specifications
Test Conditions: VCC = 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = 25C, Note 4 (Continued) SYMBOL TEST CONDITIONS TEMP (C) MIN TYP MAX UNITS
PARAMETER NOTE:
4. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. 5. Supply current specification is valid for loaded drivers when DE = 0V. 6. Applies to peak current. See "Typical Performance Curves" for more information. 7. When testing devices with the shutdown feature, keep RE = 0 to prevent the device from entering SHDN. 8. When testing devices with the shutdown feature, the RE signal high time must be short enough (typically <100ns) to prevent the device from entering SHDN. 9. Versions with a shutdown feature are put into shutdown by bringing RE high and DE low. If the inputs are in this state for less than 50ns, the parts are guaranteed not to enter shutdown. If the inputs are in this state for at least 600ns, the parts are guaranteed to have entered shutdown. See "Low-Power Shutdown Mode" section. 10. Keep RE = VCC, and set the DE signal low time >600ns to ensure that the device enters SHDN. 11. Set the RE signal high time >600ns to ensure that the device enters SHDN. 12. Does not apply to the ISL83071E. 13. tSKEW is the magnitude of the difference in propagation delays of the specified terminals of two units tested with identical test conditions (VCC, temperature, etc.). Only applies to the ISL83076E - 78E. 14. ISL83070E - ISL83075E only. 15. VCC 3.15V 16. Guaranteed by design and characterization, but not production tested.
Test Circuits and Waveforms
VCC
DE DI Z D Y VOD
RL/2 VCC
DE DI Z D Y VOD RL = 60
375 VCM -7V to +12V 375
RL/2
VOC
FIGURE 1A. VOD AND VOC
FIGURE 1B. VOD WITH COMMON MODE LOAD FIGURE 1. DC DRIVER TEST CIRCUITS
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Test Circuits and Waveforms (Continued)
3V DI 1.5V 1.5V 0V
VCC
DE DI D Y Z RDIFF CD OUT (Y) OUT (Z)
tPLH
tPHL VOH VOL
SIGNAL GENERATOR DIFF OUT (Y - Z) tR
90% 10%
90% 10% tF
+VOD -VOD
SKEW = |tPLH - tPHL|
FIGURE 2A. TEST CIRCUIT
FIGURE 2B. MEASUREMENT POINTS
FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES
DE DI SIGNAL GENERATOR Z D Y 50pF SW 500 VCC GND tZH, tZH(SHDN) NOTE 9 OUT (Y, Z) OUTPUT HIGH VOH - 0.25V 50% 0V tZL, tZL(SHDN) NOTE 9 OUT (Y, Z) 50% VOL + 0.25V V OUTPUT LOW
OL
3V DE NOTE 9 1.5V 1.5V 0V tHZ VOH
PARAMETER tHZ tLZ tZH tZL tZH(SHDN) tZL(SHDN)
OUTPUT Y/Z Y/Z Y/Z Y/Z Y/Z Y/Z
RE X X 0 (Note 7) 0 (Note 7) 1 (Note 10) 1 (Note 10)
DI 1/0 0/1 1/0 0/1 1/0 0/1
SW GND VCC GND VCC GND VCC FIGURE 3B. MEASUREMENT POINTS
tLZ
VCC
FIGURE 3A. TEST CIRCUIT
FIGURE 3. DRIVER ENABLE AND DISABLE TIMES (EXCEPT ISL83071E)
3V DI VCC DE DI D Y SIGNAL GENERATOR Z 54 CD
+
0V
VOD
-
DIFF OUT (Y - Z) -VOD
+VOD
0V
FIGURE 4A. TEST CIRCUIT FIGURE 4. DRIVER DATA RATE
FIGURE 4B. MEASUREMENT POINTS
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Test Circuits and Waveforms (Continued)
RE GND B A R RO tPLH SIGNAL GENERATOR 1.5V tPHL VCC RO 1.5V 0V +1.5V 15pF A 0V 0V -1.5V
FIGURE 5A. TEST CIRCUIT
FIGURE 5B. MEASUREMENT POINTS
FIGURE 5. RECEIVER PROPAGATION DELAY
NOTE 9 RE GND SIGNAL GENERATOR B A R RO 1k SW 15pF VCC GND tZH, tZH(SHDN) NOTE 9 RO tHZ OUTPUT HIGH VOH - 0.25V 1.5V 0V VOH 3V RE 1.5V 1.5V 0V
PARAMETER tHZ tLZ tZH (Note 8) tZL (Note 8) tZH(SHDN) (Note 11) tZL(SHDN) (Note 11)
DE X X 0 0 0 0
A +1.5V -1.5V +1.5V -1.5V +1.5V -1.5V
SW GND VCC GND VCC GND VCC
tZL, tZL(SHDN) NOTE 9 RO 1.5V
tLZ VCC VOL + 0.25V V OUTPUT LOW
OL
FIGURE 6A. TEST CIRCUIT
FIGURE 6B. MEASUREMENT POINTS
FIGURE 6. RECEIVER ENABLE AND DISABLE TIMES (EXCEPT ISL83071E)
Application Information
RS-485 and RS-422 are differential (balanced) data transmission standards for use in long haul or noisy environments. RS-422 is a subset of RS-485, so RS-485 transceivers are also RS-422 compliant. RS-422 is a pointto-multipoint (multidrop) standard, which allows only one driver and up to 10 (assuming one unit load devices) receivers on each bus. RS-485 is a true multipoint standard, which allows up to 32 one unit load devices (any combination of drivers and receivers) on each bus. To allow for multipoint operation, the RS-485 spec requires that drivers must handle bus contention without sustaining any damage. Another important advantage of RS-485 is the extended common mode range (CMR), which specifies that the driver outputs and receiver inputs withstand signals that range from +12V to -7V. RS-422 and RS-485 are intended for runs as 10
long as 4000', so the wide CMR is necessary to handle ground potential differences, as well as voltages induced in the cable by external fields.
Receiver Features
These devices utilize a differential input receiver for maximum noise immunity and common mode rejection. Input sensitivity is better than 200mV, as required by the RS-422 and RS-485 specifications. Receiver input resistance of 96k surpasses the RS-422 spec of 4k, and is eight times the RS-485 "Unit Load (UL)" requirement of 12k minimum. Thus, these products are known as "one-eighth UL" transceivers, and there can be up to 256 of these devices on a network while still complying with the RS-485 loading spec. Receiver inputs function with common mode voltages as great as +9V/-7V outside the power supplies (i.e., +12V and
FN6115.0 June 1, 2005
-7V), making them ideal for long networks where induced voltages, and ground potential differences, are realistic concerns. All the receivers include a "full fail-safe" function that guarantees a high level receiver output if the receiver inputs are unconnected (floating) or shorted. Fail-safe with shorted inputs is achieved by setting the Rx upper switching point to -50mV, thereby ensuring that the Rx sees 0V differential as a high input level. Receivers easily meet the data rates supported by the corresponding driver, and all receiver outputs - except on the ISL83071E- are tri-statable via the active low RE input.
suppression diodes), and the associated, undesirable capacitive load they present.
Data Rate, Cables, and Terminations
RS-485/422 are intended for network lengths up to 4000', but the maximum system data rate decreases as the transmission length increases. Devices operating at 20Mbps are limited to lengths less than 100', while the 250kbps versions can operate at full data rates with lengths of several thousand feet. Twisted pair is the cable of choice for RS-485/422 networks. Twisted pair cables tend to pick up noise and other electromagnetically induced voltages as common mode signals, which are effectively rejected by the differential receivers in these ICs. Proper termination is imperative, when using the 20Mbps devices, to minimize reflections. Short networks using the 250kbps versions need not be terminated, but, terminations are recommended unless power dissipation is an overriding concern. In point-to-point, or point-to-multipoint (single driver on bus) networks, the main cable should be terminated in its characteristic impedance (typically 120) at the end farthest from the driver. In multi-receiver applications, stubs connecting receivers to the main cable should be kept as short as possible. Multipoint (multi-driver) systems require that the main cable be terminated in its characteristic impedance at both ends. Stubs connecting a transceiver to the main cable should be kept as short as possible.
Driver Features
The RS-485/422 driver is a differential output device that delivers at least 1.5V across a 54 load (RS-485), and at least 2V across a 100 load (RS-422). The drivers feature low propagation delay skew to maximize bit width, and to minimize EMI. All drivers are tri-statable via the active high DE input, except on the ISL83071E. The 250kbps and 500kbps driver outputs are slew rate limited to minimize EMI, and to reduce reflections in unterminated or improperly terminated networks. Outputs of the ISL83076E, ISL83078E drivers are not limited, so faster output transition times allow data rates of at least 20Mbps.
Hot Plug Function
When a piece of equipment powers up, there is a period of time where the processor or ASIC driving the RS-485 control lines (DE, RE) is unable to ensure that the RS-485 Tx and Rx outputs are kept disabled. If the equipment is connected to the bus, a driver activating prematurely during power up may crash the bus. To avoid this scenario, the ISL8307XE family incorporates a "Hot Plug" function. During power up, circuitry monitoring VCC ensures that the Tx and Rx outputs remain disabled for a period of time, regardless of the state of DE and RE. This gives the processor/ASIC a chance to stabilize and drive the RS-485 control lines to the proper states.
Built-In Driver Overload Protection
As stated previously, the RS-485 spec requires that drivers survive worst case bus contentions undamaged. These devices meet this requirement via driver output short circuit current limits, and on-chip thermal shutdown circuitry. The driver output stages incorporate short circuit current limiting circuitry which ensures that the output current never exceeds the RS-485 spec, even at the common mode voltage range extremes. Additionally, these devices utilize a foldback circuit which reduces the short circuit current, and thus the power dissipation, whenever the contending voltage exceeds either supply. In the event of a major short circuit condition, devices also include a thermal shutdown feature that disables the drivers whenever the die temperature becomes excessive. This eliminates the power dissipation, allowing the die to cool. The drivers automatically re-enable after the die temperature drops about 15 degrees. If the contention persists, the thermal shutdown/re-enable cycle repeats until the fault is cleared. Receivers stay operational during thermal shutdown.
ESD Protection
All pins on these devices include class 3 (>7kV) Human Body Model (HBM) ESD protection structures, but the RS-485 pins (driver outputs and receiver inputs) incorporate advanced structures allowing them to survive ESD events in excess of 15kV HBM. The RS-485 pins are particularly vulnerable to ESD damage because they typically connect to an exposed port on the exterior of the finished product. Simply touching the port pins, or connecting a cable, can cause an ESD event that might destroy unprotected ICs. These new ESD structures protect the device whether or not it is powered up, protect without allowing any latchup mechanism to activate, and without degrading the RS-485 common mode range of -7V to +12V. This built-in ESD protection eliminates the need for board level protection structures (e.g., transient 11
Low Power Shutdown Mode
These CMOS transceivers all use a fraction of the power required by their bipolar counterparts, but they also include a shutdown feature that reduces the already low quiescent ICC to a 10nA trickle. These devices enter shutdown whenever the receiver and driver are simultaneously disabled (RE = VCC and DE = GND) for a period of at least 600ns.
FN6115.0 June 1, 2005
Disabling both the driver and the receiver for less than 50ns guarantees that the transceiver will not enter shutdown.
Note that receiver and driver enable times increase when the transceiver enables from shutdown. Refer to Notes 7-11, at the end of the Electrical Specification table, for more information.
Typical Performance Curves
120 DRIVER OUTPUT CURRENT (mA) 100 80 60 40 20 0
VCC = 3.3V, TA = 25C; Unless Otherwise Specified
2.35 DIFFERENTIAL OUTPUT VOLTAGE (V) 2.3 2.25 2.2 2.15 2.1 2.05 2 1.95 1.9 1.85 -40 -25 0 25 50 75 85 RDIFF = 54 RDIFF = 100
0
0.5 1 1.5 2 2.5 DIFFERENTIAL OUTPUT VOLTAGE (V)
3
3.5
TEMPERATURE (C)
FIGURE 7. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT VOLTAGE
FIGURE 8. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs TEMPERATURE
200 150 Y OR Z = LOW OUTPUT CURRENT (mA) 100 50 ICC (mA) 0 -50 Y OR Z = HIGH ISL8307XE -7 -6 -4 -2 0 2 4 6 OUTPUT VOLTAGE (V) 8 10 12 0.47 ISL83072/5/8, DE = 0V, RE = 0V ISL83076E/78E ISL83070E thru ISL83075E 0.52 ISL83072/5/8, DE = VCC, RE = X 0.51
0.5 ISL83070/3/6, DE = X, RE = 0V; ISL83071
0.49
0.48
-100 -150
0.46 -40
-25
0
25
50
75
85
FIGURE 9. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT VOLTAGE
TEMPERATURE (C)
FIGURE 10. SUPPLY CURRENT vs TEMPERATURE
12
FN6115.0 June 1, 2005
Typical Performance Curves
1220 1200 PROPAGATION DELAY (ns)
VCC = 3.3V, TA = 25C; Unless Otherwise Specified (Continued)
8
7.5 1180 1160 1140 1120 1100 tPLH 1080 -40 5.5 -25 0 25 TEMPERATURE (C) 50 75 85 -40 -25 0 25 TEMPERATURE (C) 50 75 85 |CROSS PT. OF Y & Z - CROSS PT. OF Y & Z| SKEW (ns) tPHL SKEW (ns) tPHL tPLH 340 -40 -25 0 25 TEMPERATURE (C) 50 75 85 0.2 -40 7
6.5
6
FIGURE 11. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL83070E, ISL83071E, ISL83072E)
370
FIGURE 12. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE (ISL83070E, ISL83071E, ISL83072E)
1.4
365 PROPAGATION DELAY (ns)
1.2
360
1
355
0.8
350
0.6
345
0.4 |CROSS PT. OF Y & Z - CROSS PT. OF Y & Z| -25 0 25 TEMPERATURE (C) 50 75 85
FIGURE 13. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL83073E, ISL83075E)
32 31
FIGURE 14. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE (ISL83073E, ISL83075E)
0.95 0.9
PROPAGATION DELAY (ns)
30 29 SKEW (ns) tPLH 28 27 26 25 24 23 22 -40 -25 0 25 TEMPERATURE (C) 50 75 85 0.65 |CROSS PT. OF Y & Z - CROSS PT. OF Y & Z| 0.6 -40 -25 0 25 TEMPERATURE (C) 50 75 85 tPHL 0.85 0.8 0.75 0.7
FIGURE 15. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL83076E, ISL83078E)
FIGURE 16. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE (ISL83076E, ISL83078E)
13
FN6115.0 June 1, 2005
Typical Performance Curves
RECEIVER OUTPUT (V)
VCC = 3.3V, TA = 25C; Unless Otherwise Specified (Continued)
DRIVER INPUT (V) DRIVER INPUT (V) DRIVER INPUT (V)
DRIVER INPUT (V)
RECEIVER OUTPUT (V)
RDIFF = 54, CD = 50pF DI
RDIFF = 54, CD = 50pF DI
5 0
5 0
5 0
5 0
RO
RO
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
3 2.5 2 1.5 1 0.5 0 TIME (400ns/DIV) A/Y B/Z
3 2.5 2 1.5 1 0.5 0 TIME (400ns/DIV) B/Z A/Y
FIGURE 17. DRIVER AND RECEIVER WAVEFORMS, LOW TO HIGH (ISL83070E, ISL83071E, ISL83072E)
DRIVER INPUT (V) RECEIVER OUTPUT (V)
FIGURE 18. DRIVER AND RECEIVER WAVEFORMS, HIGH TO LOW (ISL8070E, ISL83071E, ISL83072E)
RECEIVER OUTPUT (V)
RDIFF = 54, CD = 50pF DI
RDIFF = 54, CD = 50pF DI
5 0
5 0
5 0
5 0
RO
RO
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
3 2.5 2 1.5 1 0.5 0 TIME (200ns/DIV) A/Y B/Z
3 2.5 2 1.5 1 0.5 0 TIME (200ns/DIV) B/Z A/Y
FIGURE 19. DRIVER AND RECEIVER WAVEFORMS, LOW TO HIGH (ISL83073E, ISL83075E)
DRIVER INPUT (V) RECEIVER OUTPUT (V)
FIGURE 20. DRIVER AND RECEIVER WAVEFORMS, HIGH TO LOW (ISL8073E, ISL83075E)
RECEIVER OUTPUT (V) RDIFF = 54, CD = 50pF DI
RDIFF = 54, CD = 50pF DI
5 0
5 0
5 0
5 0
RO
RO
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
3 2.5 2 1.5 1 0.5 0 TIME (10ns/DIV) A/Y B/Z
3 2.5 2 1.5 1 0.5 0 TIME (10ns/DIV) B/Z A/Y
FIGURE 21. DRIVER AND RECEIVER WAVEFORMS, LOW TO HIGH (ISL83076E, ISL83078E)
FIGURE 22. DRIVER AND RECEIVER WAVEFORMS, HIGH TO LOW (ISL8076E, ISL83078E)
14
FN6115.0 June 1, 2005
Typical Performance Curves
35 RECEIVER OUTPUT CURRENT (mA) 30 25
VCC = 3.3V, TA = 25C; Unless Otherwise Specified (Continued)
VOL, 25C
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP): GND TRANSISTOR COUNT:
VOL, 85C 20 15 10 5 0 VOH, 25C VOH, 85C
535 PROCESS: Si Gate BiCMOS
0
0.5
1
1.5
2
2.5
3
3.5
RECEIVER OUTPUT VOLTAGE (V)
FIGURE 23. RECEIVER OUTPUT CURRENT vs RECEIVER OUTPUT VOLTAGE
15
FN6115.0 June 1, 2005
Mini Small Outline Plastic Packages (MSOP)
N
M8.118 (JEDEC MO-187AA)
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
E1 -BE
INCHES SYMBOL A
ABC
MILLIMETERS MIN 0.94 0.05 0.75 0.25 0.09 2.95 2.95 MAX 1.10 0.15 0.95 0.36 0.20 3.05 3.05 NOTES 9 3 4 6 7 15o 6o Rev. 2 01/03
MIN 0.037 0.002 0.030 0.010 0.004 0.116 0.116
MAX 0.043 0.006 0.037 0.014 0.008 0.120 0.120
INDEX AREA
12 TOP VIEW
0.20 (0.008)
A1 A2
4X
0.25 (0.010) GAUGE PLANE SEATING PLANE -CA A2
R1 R
b c D E1
4X
L L1
e E L L1 N R
0.026 BSC 0.187 0.016 8 0.003 0.003 5o 0o 15o 6o 0.199 0.028
0.65 BSC 4.75 0.40 8 0.07 0.07 5o 0o 5.05 0.70
A1
-He D
b
0.10 (0.004) -A0.20 (0.008)
C
SEATING PLANE
0.037 REF
0.95 REF
C a C L E1
C
R1 0
SIDE VIEW
-B-
0.20 (0.008)
CD
END VIEW
NOTES: 1. These package dimensions are within allowable dimensions of JEDEC MO-187BA. 2. Dimensioning and tolerancing per ANSI Y14.5M-1994. 3. Dimension "D" does not include mold flash, protrusions or gate burrs and are measured at Datum Plane. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E1" does not include interlead flash or protrusions and are measured at Datum Plane. - H - Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. Formed leads shall be planar with respect to one another within 0.10mm (0.004) at seating Plane. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of "b" dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. Datums -A -H- . and - B - to be determined at Datum plane
11. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only.
16
FN6115.0 June 1, 2005
Small Outline Plastic Packages (SOIC)
N INDEX AREA H E -B1 2 3 SEATING PLANE -AD -CA h x 45o 0.25(0.010) M BM
M8.15 (JEDEC MS-012-AA ISSUE C)
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A
L
MILLIMETERS MIN 1.35 0.10 0.33 0.19 4.80 3.80 MAX 1.75 0.25 0.51 0.25 5.00 4.00 NOTES 9 3 4 5 6 7 8o Rev. 0 12/93
MIN 0.0532 0.0040 0.013 0.0075 0.1890 0.1497
MAX 0.0688 0.0098 0.020 0.0098 0.1968 0.1574
A1 B C D E e
C

A1 0.10(0.004)
e
B 0.25(0.010) M C AM BS
0.050 BSC 0.2284 0.0099 0.016 8 0o 8o 0.2440 0.0196 0.050
1.27 BSC 5.80 0.25 0.40 8 0o 6.20 0.50 1.27
H h L N
NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width "B", as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
17
FN6115.0 June 1, 2005
Small Outline Plastic Packages (SOIC)
N INDEX AREA H E -B1 2 3 SEATING PLANE -AD -CA h x 45o 0.25(0.010) M BM
M14.15 (JEDEC MS-012-AB ISSUE C)
14 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A
L
MILLIMETERS MIN 1.35 0.10 0.33 0.19 8.55 3.80 MAX 1.75 0.25 0.51 0.25 8.75 4.00 NOTES 9 3 4 5 6 7 8o Rev. 0 12/93
MIN 0.0532 0.0040 0.013 0.0075 0.3367 0.1497
MAX 0.0688 0.0098 0.020 0.0098 0.3444 0.1574
A1 B C D E e
C

A1 0.10(0.004)
e
B 0.25(0.010) M C AM BS
0.050 BSC 0.2284 0.0099 0.016 14 0o 8o 0.2440 0.0196 0.050
1.27 BSC 5.80 0.25 0.40 14 0o 6.20 0.50 1.27
H h L N
NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width "B", as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation's quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com 18
FN6115.0 June 1, 2005

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